Tag Archives: Wafer

1366 Technologies Introduces “3D” Wafer Feature

published 2016 年 08 月 17 日 17:53 | editor | category News
1366 Technologies (1366) unveiled the first of a series of R&D achievements that have the potential to change the way the solar industry thinks about wafer features. The company’s proprietary Direct Wafer pro...  more

GET’s Diamond Wire Technology Officially Granted Patent

published 2016 年 07 月 22 日 17:06 | editor | category News
The “Etching Solution and Method of Surface Roughening of Silicon Substrate”, a diamond wire technology originally invented by Green Energy Technology (GET) is officially granted patent by Taiwan Patent and Intellectua...  more