Currently, the efficiency of single-junction crystalline silicon solar cells is approaching the theoretical limit of 29.56%, prompting the industry to urgently explore new technological pathways to further enhance conversion efficiency. According to the International Energy Agency, the next five years will be a critical window for technological innovation in the global PV industry. Among these new technologies, tandem perovskite technology, with its ultra-high theoretical efficiency, is regarded as the next disruptive direction for the PV industry. However, stability remains a bottleneck for its industrialization, and encapsulation technology plays a crucial role in ensuring that stability.
As the industry's first initiator of perovskite encapsulation technology standards, Betterial has long been dedicated to the reliability research of encapsulation technologies for perovskite and tandem perovskite modules. Their newly launched Betterial® Encapsulant for Tandem Perovskite has achieved five major technological breakthroughs, further driving the industrialization process of tandem perovskite technology.
Outstanding Crosslinking and Peel Strength at Ultra-Low Laminating Temperatures
Compared to traditional thermoplastic films, Betterial's tandem perovskite special adhesive film uses a reactive formulation solution that enables ultra-low laminating temperatures of 110–120°C while achieving a high crosslinking degree of 10–60%. After undergoing three times the IEC sequence aging test, the peel strength exceeds 60 N/cm. This effectively ensures the module's high and low-temperature resistance, improving product reliability and stability.
Low-Temperature Crosslinking Technology Without Peroxide Residue
Developed in collaboration with leading international chemical raw material suppliers over many years, Betterial's unique peroxide-free formulation delivers high product purity and no small-molecule precipitation. This effectively prevents the chemical corrosion risks that peroxide decomposition residues in traditional crosslinked encapsulants pose to the perovskite layer, safeguarding the structural integrity and stability of the perovskite layer.
Excellent Heat and Weather Resistance
Compared to conventional thermoplastic encapsulants, Betterial's encapsulant offers outstanding resistance to high temperatures and humidity, with a low water vapor transmission rate. Test results show that after 48 hours of heat aging at 150°C and 48 hours of PCT testing, the encapsulant demonstrates excellent anti-yellowing performance, with no bubbles or delamination observed in the module tests.
Halide Ion Capture Technology for Perovskite Encapsulation
Betterial's encapsulant incorporates a unique functional nano-micro material with a surface rich in mesoporous channels. During long-term operation or aging of perovskite cells, it can efficiently and rapidly capture and immobilize volatile halide ions (such as F⁻, Br⁻, I⁻) as well as harmful Pb²⁺ ions. This effectively blocks the migration paths of harmful ions, significantly reducing perovskite layer passivation failure and interfacial delamination caused by ion migration.
Adaptability to Multiple Technologies
Betterial's tandem perovskite encapsulation technology features an excellent process window and broad material compatibility. In addition to tandem perovskite modules, it can flexibly adapt to single-junction perovskite modules, thin-film modules, and lightweight modules, demonstrating strong platform-level technological advantages.
Betterial's tandem perovskite encapsulation technology provides a reliable material foundation for the development of high-efficiency, long-lifespan, low-degradation tandem perovskite module products. Looking ahead, Betterial will continue to focus on innovation in encapsulation materials, contributing to a future of higher efficiency, lower costs, and greater sustainability in the solar PV industry.
To learn more about Betterial's special encapsulation technology solutions, come and visit us at Booth 2.2H-E110 for discussions and collaboration.