On January 23, Tongwei Co., Ltd. released an announcement declaring the successful completion of its first tranche of Green Technology Innovation Notes for 2026. The actual issuance volume reached RMB 500 million, with all raised funds fully received.
The bond is referred to by the short name "26 Tongwei GN001 (Sci-Tech Innovation Bond)" under the bond code 132680004. The issuance interest rate was fixed at 2.15%. The notes carry a "1+1 year" term structure, with a value date of January 22, 2026, and a redemption date scheduled for January 22, 2028.
China CITIC Bank acted as the lead underwriter for this issuance, while Shanghai Pudong Development Bank (SPDB) and Bank of Tianjin served as joint lead underwriters. The funds raised will be utilized to support the company's business development in the green technology sector.
The issuance of these Green Technology Innovation Notes represents a significant measure by Tongwei Co., Ltd. to utilize innovative financial instruments for financing within the interbank market, further facilitating the advancement of its green technology-related operations.
As the opening issuance of 2026, this bond retains the "1+1 year" long-term structure established at the end of last year. Although the 2.15% issuance rate represents a slight rebound from the lows seen at the end of 2025, it remains lower than the 2.20% rate of the 270-day Super Short-term Commercial Paper (SCP) issued in July 2025.
Source：EnergyTrend