On June 21st, 2010, GCL-Poly Energy Holdings Limited (SEHK: 3800) held the celebration ceremony in Xuzhou economic-technical development zone in Jiangsu Province, because GCL-Poly’s wafer capacity has reached 1.2GW and the Group is expected to ramp up its wafer capacity to a target of 2.0GW by the end of this October.
On January 29, 2010, the first batch of 8-inch polysilicon wafers successfully rolled off the production line. Supported by the government of Xuzhou, Jiangsu Province, east China, the Hong Kong-listed company's first silicon wafer project became operational ahead of schedule.
The Phase One is equipped with such advanced facilities as the GTSolar polycrystalline silicon ingot furnace as well as the newest-generation slicers of Meyer Burger and NTC, and all of the cleaning and testing production lines are automatic. According to the development scheme, it will yield 500MW 8-inch polysilicon wafers per year.
