In January 2023, RoboTechnik and SPIC entered into a strategic cooperation agreement for VDI electroplating solutions targeting copper grid wire heterojunction cells. The technical teams of both companies successfully completed the first stage of feasibility testing for the equipment in February, surpassing expectations. They proceeded to conduct the second stage of testing in March.
In June, RoboTechnik delivered an additional 1GW of coating equipment to its primary customer. On June 29, Sunwell organized a meeting to introduce the technology of coated copper. Sunwell aims to achieve the delivery of a GW-level HJT coating line in 2023, an 8GW HJT copper coating order in 2024, and a 20GW HJT copper plating order in 2025. The accelerated industrialization of copper coating is expected to drive cost reduction and increase the efficiency of HJT.
